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Aerospace
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Electronics Cooling
Micro Aerodynamics
Space Engineering
Structures
Thin Film Deposition
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Engineering
Solutions International Limited,
Unit
8
Kinsealy
Business
Park
Kinsealy,
Co.
Dublin
,
Ireland.
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Engineering
Solutions
International
Limited
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ESIL
uses advanced computational techniques to simulate and model
thin film deposition methods such as Chemical Vapour
Deposition, Physical Vapour Deposition and Atomic Layer
Deposition.
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We
use a number of commercial CFD and surface chemistry software
packages, to prediction two-dimensional or three-dimensional
topological evolution for thin film deposition processes. The
result of this is a shortened product development cycle and an
increase in product functionality and reliability.
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ESIL
has particular experience in Atomic Layer Deposition (ALD).
Also known as Atomic Layer Epitaxy (ALE), ALD refers to the
controlled deposition of single atomic layers onto a substrate.
For gas-phase reactors, typically achieved by pulsing the
precursors, interspersed with inert gases, ESIL can model
the transient surface reaction mechanisms, including time
accurate surface species concentrations with transient
three-dimensional heat and mass transfer.
This technology is primarily used by the Semi-conductor
industry.
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ESIL
has experience in both reactor and feature scale models for
detailed analyses of feature evolution on the micron and
sub-micron scale.
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